# Program 1
# Purpose: calculate the number of dies (chips) of given size that can be
# manufactured from a silicon wafer of given size
# Pre-conditions: diameter of the silicon wafer (float) (mm) and the
# desired area of the chip (square mm) (float)
# Post-conditions: area of the wafer (float) (square mm), number of dies
# (integer)
# import sqrt and pi from the math library
# print title
# input diameter and desired die area (floats)
# if die area is negative or zero
# give error message
# otherwise
# calculate wafer area using pi time radius squared
# calculate number of dies cut from the wafer using formula given
# output the results formatted with float 2 decimals for wafer area
# and integer number of dies
# output disclaimer
'''
Test Cases
A. input 400, 25.0 wafer area = 125663.708, number of dies = 4848
B. input 320, 75.0 wafer area = 80424.773, number of dies = 990
C. input 450, 12.5 wafer area = 159043.130, number of dies = 12440
'''